Global Display 기술 선도기업 “신도기연”

OLED

3D Lamination 2D Lamination Roll Lamination

Overview

Cover Glass 와 LCD/OLED 패널의 부착(Lamination) , CPI (Colorless PI) 나 UTG(Ultra Thin Glass)와 OLED Panel을 부착하는 진공 부착 (Vacuum Lami) 설비이다.

Inline M/C

Application

- Panel + Cover Glass 부착 (LCD&OLED)

- POL 부착, TSP 부착 등

- Foldable (Panel +CU Sheet 부착, PI + Panel 부착 등)

Specification

- Film 공급방식: Magazine type

- Cleaning: USC, Plasma, Roller

- Panel Size: Min1inch, Max 18inch(TBD)

- Alignment Type: Vision Align

SHINDO

High Quality Product, Creative Technology SHINDO

Shindo Eng Lab Provides also Creative Technology for the best productivity..