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Overview

It is a Equipment to heat and pressurize for Interconnecting the μ LED attached on the ACF to the pattern on the top of the glass

Application

- Flexible Display

- Semiconductor back film Lamination

- Contruction vacuum glass

- Micor-LED

Specification

- Heater: Cartridge Heater

- Silicone Jig: detachable. Exchange mounting structure outside the machine

- Internal coolant : SUS Pipe

- apply optical Sensor , double safety device

- Max Temperature: 200 degree

- Max Compressor: 20Kgf

SHINDO

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