OLED
设备概览
Cover Glass 与 LCD/OLED 屏体的贴合(Lamination) ,CPI (Colorless PI) 或 UTG(Ultra Thin Glass)与 OLED 屏体贴合的真空贴合(Vacuum Lami)设备。
Inline M/C
应用范围
- 屏体 + 玻璃盖板贴合(LCD&OLED)
- POL 贴合,TSP 贴合
- 折叠屏(屏体 + CU sheet 贴合,PI + 屏体贴合)
功能简介
- Film 供给方式: Magazine 方式
- 清洁: USC, Plasma, Roller
- 屏体尺寸: 最小 1inch, 最大 18inch (TBD)
- 校正方是: Vision Align
High Quality Product, Creative Technology SHINDO
Shindo Eng Lab Provides also Creative Technology for the best productivity..